gaas mmic power amplifier 2.0 - 6.5 ghz rev. v7 maam26100 1 1 m/a - com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macom.com for additional data sheets and product information. for further information and support please visit: https://www.macom.com/support 1 features ? saturated power: 30.5 dbm typical ? gain: 19 db typical ? power added efficiency: 30% ? on - chip bias network ? dc decoupled rf input and output ? rohs* compliant description the maam26100 is a gaas mmic two stage high efficiency power amplifier. the maam26100 is a fully monolithic design which eliminates the need for external circuitry in 50 - ohm systems. the maam26100 is ideally suited for driver amplifiers and transmitter outputs in umts applications, test equipment, electronic warfare jammers, missile subsystems and phased array radars. the maam26100 is fabricated using a mature 0.5 - micron gate length gaas process. the process features full passivation for increased performance reliability. ordering information part number package maam26100 die die absolute maximum ratings 1,2 parameter absolute maximum v dd +9 v v g1 , v g2 - 2.5 v to - 0.8 v v gg 3 - 6 v to - 3 v rf input power +17 dbm channel temperature 150c storage temperature - 65c to +150c 1. exceeding any one or combination of these limits may cause permanent damage to this device and will void product warranty. 2. m/a - com does not recommend sustained operation near these survivability limits. 3. v gg rating applies when using the optional on - chip resistor network.
gaas mmic power amplifier 2.0 - 6.5 ghz rev. v7 maam26100 2 2 m/a - com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macom.com for additional data sheets and product information. for further information and support please visit: https://www.macom.com/support 2 electrical specifications: t a = 25c, z 0 = 50 , v dd = +8 v, v gg = - 1.3 v nominal parameter test conditions units min. typ. max. small signal gain 2 - 6 ghz db 15 19 input vswr 2 - 6 ghz ratio - 2.0:1 output vswr 2 - 6 ghz ratio 2.2:1 saturated output power input power +14 dbm, 2 - 6 ghz dbm 29 30.5 output power at 1 db gain compression 2 - 6 ghz dbm 28 power added efficiency % 30 third order intercept 2 - 6 ghz dbm 39 reverse isolation 2 - 6 ghz db 30 bias current no rf p in = +14 dbm ma ma 390 475 650 thermal resistance 4 c/w 14 4. attachment method not included. schematic v d 1 v g g v g 2 g n d v d 2 r f o u t a 2 b 2 c 2 d 2 e 2 g n d v g 2 a 1 b 1 c 1 d 1 e 1 v g 1 r f i n
gaas mmic power amplifier 2.0 - 6.5 ghz rev. v7 maam26100 3 3 m/a - com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macom.com for additional data sheets and product information. for further information and support please visit: https://www.macom.com/support 3 typical performance curves input return loss gain power added efficiency @ p in = +14 dbm output power @ p in = +14 dbm 0 5 10 15 20 25 1.5 2.5 3.5 4.5 5.5 6.5 7.5 frequency (ghz) -25 -20 -15 -10 -5 0 1.5 2.5 3.5 4.5 5.5 6.5 7.5 frequency (ghz) 0 10 20 30 40 50 1.5 2.5 3.5 4.5 5.5 6.5 7.5 frequency (ghz) 24 26 28 30 32 34 1.5 2.5 3.5 4.5 5.5 6.5 7.5 frequency (ghz)
gaas mmic power amplifier 2.0 - 6.5 ghz rev. v7 maam26100 4 4 m/a - com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macom.com for additional data sheets and product information. for further information and support please visit: https://www.macom.com/support 4 bonding table 7 bin # bond pads 1 e1 to v g1 , e2 to v g2 2 d1 to v g1 , d2 to v g2 3 c1 to v g1 , c2 to v g2 4 b1 to v g1 , b2 to v g2 7. optional on - chip resistor networks are used by connecting a nominal - 5 volts to the pad v gg then connecting pads per the bonding table. each gel pack is labeled with a cd # which corresponds to a bin # in the bonding table. for example, cd1 on the gel pack corresponds to bin 1, which means that pad e1 must be connected to pad v g1 and pad e2 must be connected to pad v g2 . typical bias configuration 5,6 5. nominal bias is obtained by first connecting - 1.3 volts to pads v g1 and v g2 followed by connecting +8 volts to pads v d1 and v d2 (note sequence). 6. the recommended v dd range is +6 to +9 volts. handling procedures permanent damage to the maam26100 may occur if the following precautions are not adhered to: a. cleanliness - the maam26100 should be han- dled in a clean environment. do not attempt to clean assembly after the maam26100 is installed. b. static sensitivity - all die handling equipment and personnel should comply with dod - std - 1686 class i. c. transients - avoid instrument and power sup- ply transients while bias is connected to the maam26100. use shielded signal and bias cables to minimize inductive pick - up. d. general handling - do not touch the surface of the die. it is recommended that the maam26100 die be handled along the long side with a sharp pair of tweezers. mounting the maam26100 is back - metallized with pd/ni/au (100/1,000/30,000?) metallization. it is recom- mended that the die be mounted with au/sn eutec- tic preforms. the attachment surface should be clean and flat. a. an 80/20 preform is recommended with a work surface temperature of approximately 255c and a tool temperature of 265c. when hot 90/5 nitrogen/hydrogen gas is applied, solder temperature should be approximately 290c. b. do not expose the maam26100 to a tem- perature greater than 320c for more than 20 seconds. no more than 3 seconds of scrub- bing should be required for attachment. bonding a. ball or wedge bond with 1.0 mil diameter gold wire of 3.0 mil x 0.5 mil ribbon. thermosonic bonding with a nominal stage temperature of 150c and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. ultrasonic energy and time should be adjusted to the minimum levels necessary to achieve reliable bonds. b. bonds should be started on the die and termi- nated on the package. c. bonding pads are 4.0 x 4.0 mils minimum. v g g ( v g 1 , v g 2 ) 1 0 0 0 p f m i n i m u m r f o u t r f i n v d d ( v d 1 , v d 2 )
gaas mmic power amplifier 2.0 - 6.5 ghz rev. v7 maam26100 5 5 m/a - com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macom.com for additional data sheets and product information. for further information and support please visit: https://www.macom.com/support 5 pad configuration 8 die size: 2.342 x 1.802 x 0.102 mm (nominal) 8. all x,y locations are at pad center. pad no. x (mm) nominal y (mm) nominal pad size (mm) description 3 0 0 .10 x .10 vd1 4 0.6435 0 .10 x .10 vgg 5 0.9235 0 .10 x .10 vg2 6 1.0885 0 .15 x .10 gnd 7 1.954 0 .15 x .10 vd2 9 1.979 0.640 .10 x .10 gnd 10 1.979 0.840 .10 x .20 rf out 11 1.564 1.420 .10 x .10 b2 12 1.413 1.380 .10 x .10 c2 13 1.263 1.420 .10 x .10 d2 14 1.213 1.580 .15 x .10 e2 15 1.413 1.580 .15 x .10 vg2 pad no. x (mm) nominal y (mm) nominal pad size (mm) description 16 1.613 1.580 .10 x .10 a2 17 1.942 1.580 .10 x .10 gnd 19 0.5525 1.580 .10 x .10 a1 20 0.5025 1.420 .10 x .10 b1 21 0.3525 1.380 .10 x .10 c1 22 0.2025 1.420 .10 x .10 d1 23 0.1525 1.580 .10 x .10 e1 24 0.0025 1.580 .10 x .10 gnd 26 0.3525 1.580 .10 x .10 vg1 27 - 0.141 0.840 .10 x .20 rf in 28 - 0.141 0.640 .10 x .10 gnd outline drawing 3 10 9 7 6 5 4 13 12 11 17 16 15 22 14 21 20 24 23 26 19 28 27
gaas mmic power amplifier 2.0 - 6.5 ghz rev. v7 maam26100 6 6 m/a - com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macom.com for additional data sheets and product information. for further information and support please visit: https://www.macom.com/support 6 m/a - com technology solutions inc. all rights reserved. information in this document is provided in connection with m/a - com technology solutions inc ("macom") products. these materials are provided by macom as a service to its customers and may be used for informational purposes only. except as provided in macom's terms and conditions of sale for such products or in any separate agreement related to this document, macom assumes no liability whatsoever. macom assumes no responsibility for errors or omissions in these materials. macom may make changes to specifications and product descriptions at any time, without notice. macom makes no commitment to update the information and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to its specifications and product descriptions. no license, express or implied, by estoppels or otherwise, to any intellectual property rights is granted by this document. these materials are provided "as is" without warranty of any kind, either express or implied, relating to sale and/or use of macom products including liability or warranties relating to fitness for a particular purpose, consequential or incidental damages, merchantability, or infringement of any patent, copyright or other intellectual property right. macom further does not warrant the accuracy or completeness of the information, text, graphics or other items contained within these materials. macom shall not be liable for any special, indirect, incidental, or consequential damages, including without limitation, lost revenues or lost profits, which may result from the use of these materials. macom products are not intended for use in medical, lifesaving or life sustaining applications. macom customers using or selling macom products for use in such applications do so at their own risk and agree to fully indemnify macom for any damages resulting from such improper use or sale.
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